Sorter/Prober

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Sorter/Prober

Sorter picks single chip from various kinds of diced wafers and transfers it to chip tray and Prober electrically test chip to provide analysis of the quality. Quick and stable motion of our Sorter/Prober can meet your quality and productivity requirement.

WCP-150
WCP-150

WCP-150 electrically probes each chip on the diced wafer and outputs the result map.

  1. Chip size: 0.5mm x 0.5mm to 20mm x 20mm
  2. Wafer size: 4" to 8"
  3. Full automation with ring loader
  4. High voltage acceptance (3kV)
  5. Anti-spark dryer (Fluorinert coat)
  6. Image recognition of position, direction, NG mark, corner, etc.
CT-200
CT-200

Ring-to-Tray sorter for 5" to 8" wafer

  1. Chip size: 0.5mm x 0.5mm to 20mm x 20mm
  2. Image recognition of position, direction, NG mark, corner, etc.
  3. (OPTION) Backside inspection
  4. (OPTION) Rank selection by probe data
  5. (OPTION) Visual inspection
  6. (OPTION) Chip flip function
U-TL-50
U-TL-50

U-TL-50 reads number/letter on chip and transfers the chip by tray to tray handling as required.

  1. Minimum chip size: 1.5mm x 1.5mm
  2. Letter size: minimum 80 x 25 um
  3. Sort by retrieving map data
  4. Skip of unnecessary chip
  5. Data can be saved by CSV format.
PS-50M
PS-50M

Transferring equipment for 2" to 8" wafer (tray to tray)

  1. Minimum chip size: 0.25 mm x 0.25 mm
  2. At transfer of chip, chip direction is corrected.

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