Consumables

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Consumables

As precision lapping and polishing requirements become more severe we offer the highest quality consumables including slurrys, abrasives, carriers, pads, and plates for a wide range of applications including silicon, glass, compound semiconductors, ceramics, metals and more. We confidently suggest and provide the best consumable sets based on decades of experience.

Please contact us to discuss your specific consumable requirements in detail.

Pure Edge 100 series
Pure Edge 100 series

PE100 is our specially formulated slurry for patterned wafer edge polishing. We combine high stock removal and clean-ability with stability in a colloidal silica compound for mechanochemical polishing.

Pure Edge 200 series
Pure Edge 200 series

PE200 is most suitable slurry for edge polishing of silicon wafers. By adoption of new colloidal silica, polishing stability is combined with a high removal rate and a low adherence property without severe pH control.

Pad (DRP) for Edge Polishing
Pad (DRP) for Edge Polishing

DRP is a specially developed edge polishing pad for silicon wafers which is made with a cushion layer combined with an polishing layer. This pad enables high pressure, a high stock removal and long pad life for the lowest cost of ownership processing.

Lower Chuck Pad
Lower Chuck Pad

Chuck pads protect silicon wafer surfaces from staining or damage during our edge polishing process.

Notch Pad
Notch Pad

Our notch polish pads are shaped for suitability to most efficiently polish the insides the notches of silicon wafers.

Double Side Lapping Plate
Double Side Lapping Plate

The manufacturing process of high quality lapping plates demands proper casting to rid the material of impurities and maintain uniform spherical graphite content for controlling hardness (wear) and life. We take care to deliver burr free properly machined grooves to ensure only the highest quality production for superior workpiece finishes.

Single Side Lapping Plate
Single Side Lapping Plate

Speedalloy lapping plates of steel alloy exhibits a marked improvement in abrasive quality in comparison with standard casting lap plates. Hardness, strength, and removal/flatness characteristics are essential to efficiency. We also offer retaining rings of compatible composition. In addition, various steel, copper, and tin plates are also offered for hard polishing applications.

DPG Plate
DPG Plate

DPG is a diamond pellet platen providing clean surface processing that combines the efficiency of grinding with high precision surfaces. It enables high productivity by maximizing abrasion time and reduces costs compared with normal lapping by reducing waste. DPG is suitable for hard to lap material such as alumina.

Light Powder / Lapping Abrasive
Light Powder / Lapping Abrasive

SpeedFam provides a line up of abrasives for various process needs including GC (green carbide), C (carborundum) WA (white alumina), A (alumina), and FO. Our abrasives lineup covers every processing requirement from silicon to glass, ceramics, and metals etc.

Slurry
Slurry

We offer slurries for magnetic disks, glass panels, and various other polishing requirements such as semiconductor wafers.

Cerium Oxide
Cerium Oxide

SpeedFam can recommend compounds for LCD glass, optical glass, glass disks, and photo masks. We have many grades that support glass polishing in various applications.

Lapping Liquid
Lapping Liquid

Our lapping liquids are used for grinding, lapping, and hard polishing. This lineup includes 210 oil and water-based lapping vehicles 180P-10 for specific applications in abrasive dispersion and rust prevention. Also, DPG coolant liquids and diamonds slurries are available for fixed or free abrasive needs.

PVA Grinding Stone
PVA Grinding Stone

PVA Grinding Stones are used for flat, smooth and efficient processing of soft metals such as aluminum. These are widely used in the aluminum disk, spacer and head arm grinding industries. PVA is an indispensable element to reduce costs and boost production of soft metal parts in a variety of applications.

Poromeric Polishing Pad
Poromeric Polishing Pad

These polishing pads are most suitable for mechanochemical polishing of silicon wafers. These pads are flexible, durable and delicate. The micro-layer construction of these pads provides strength and durability in production. Slurry squeezed from pores on polyurethane surface enables consistent high quality surface finishes.

Cerium Pad
Cerium Pad

These polyurethane pads have cerium oxide abrasive in the hard foam base material and are particularly effective for glass polishing. These pads are available with a variety of sizes and configurations including grooves, holes and backing adhesives for fast, easy machine set up.

Cleaning Liquid
Cleaning Liquid

For post lapping and polishing we can also provide cleaning solutions for removing liquids and abrasives which may adhere to the surfaces of your workpieces.

Bellclean
Bellclean

We also offer cleaning brushes made of soft PVA sponges in various sizes and shapes. These brushes are very flexible when used with water and remove surface contamination without damaging your parts.

Carriers for Double Side Processing
Carriers for Double Side Processing

Our lineup of work carriers for double side lapping and polishing are made of various materials such as Epoxy Glass, PVC, baked cloth, SK, blue steel, and stainless for efficient precision processing of various materials.

Wedge Carriers (Insert Carriers)
Wedge Carriers (Insert Carriers)

We line the work holding parts of strong metal carriers with strengthened resin to reduce damage to workpiece edges. With this combination of strong metal and the resinous materials high pressure and damage free processing is possible.

Coated Carriers
Coated Carriers

Our coated carriers prevent chipping of your fragile workpieces, and are SpeedFam originals. These carriers which are manufactured with highly precise techniques are lightweight and ideal for soft pad polishing processes. These carriers are coated with a thin epoxy resin over a precision stainless steel carrier and are most suitable for silicon wafers, compound semiconductor wafers, and glass polish processes.

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