1 November 2011

SEMICON Japan 2011 (Makuhari Messe)

In order to meet the expectations of our customers, SpeedFam continues to develop original equipment and consumables as a pioneer of planar abrasion system. We will exhibit our advanced solutions of surface creation of latest polishing and cleaning technologies in this SEMICON Japan.

Our exhibition will include:

• Flattening system most suitable for prime silicon wafers
  For the current and future demands about productivity and quality of prime silicon wafer planarization, SpeedFam introduces the latest series of lapper, polisher and edge polisher as well as the most suitable consumables.
• Solutions for sapphire and quartz crystal wafers
  SpeedFam introduces its advanced systems for large size sapphire wafer for LED, and various equipment for ultra thin quartz crystal wafer, etc.
• Edge metrology system demonstration
  Actual Edge Profiler of Yuhi Technologies is exhibited at our booth. Edge Profiler enables efficient quality control and yield enhancement of edge grinding process by measurement of edge and notch profiles of sapphire wafer, etc.
• Cleaner
  SpeedFam introduces automated cleaner for PV (photovoltaic) wafer and precision cleaner for various kinds of materials such as quartz crystal and sapphire wafer.

SpeedFam exhibits the lineup which support up and coming demands for next generation productions.
Please be sure to visit us.

Session: 7-9 December 2011

Meeting place: Makuhari Messe

Booth No: 2D-801

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• Reference:
• SpeedFam
• sfinfo@speedfam.com